热沉材料 Heat Sink
功率电子器件和电路在运行时会产生大量的热。热沉材料有助于消除芯片热量,将其传输到其他介质,维持芯片稳定工作。 Powerelectronics and circuits produce a lot of heat when they work. Heatsink materials help to eliminate chip heat, transferring it toother media and keeping the chip stable
钼铜、钨铜、铜-钼-铜(CMC)、铜-钼铜-铜(Cu/MoCu/Cu)和多层式铜一钼-铜(S-CMC)材料结合了钼、钨的低热膨胀率和铜的高热导率,可有效释放电子器件的热量,有助于冷却|GBT模块、RF功率放大器、LED芯片等各种产品,可用于大规模集成电路和大功率微波器件中作为金属基片、热控板、热沉材料和引线框架。Molybdenumcopper, tungsten copper, and some sandwich materials such as CMC,Cu/Mocu/Cu,S-CMCcombined with low thermal expansion rate ofmolybdenum, tungsten and high thermal conductivity of caneffectively release electronics heat and contribute cooling IGBTmodule, RF power amplifier, LED and other products. They are thusapplied as metal substrate, thermal control, heat sink and the leadin large-scale integrated circuit and high power microwavedevices .
我们可以按照客户要求提供以上各种材料的板材和成品。如果需要,也可以提供镀镍、金产品。Wecan offer Wcu, Mocu, CMC, Cu/Mocu/Cu and s-cmc finished andsemi-finished products. And we can also provide these productscoated with Ni or Niau as customersneed
专业的电子封装产品镀金应该怎么样选择一个合适的厂家，专业厂家提供优质镀金服务。
牌号Material | 钨含量 | 铜含量 | 密度 | 热导率 | 热膨胀系数 |
Wt% | Wt% | g/cm3 | W/M·K | （10-6/K） | |
W90Cu10 | 90±1 | Balance | 17.0 | 180-190 | 6.5 |
W85Cu15 | 85±1 | Balance | 16.4 | 190-200 | 7.0 |
W80Cu20 | 80±1 | Balance | 15.6 | 200-210 | 8.3 |
W70Cu30 | 70±1 | Balance | 14.9 | 220-230 | 9.0 |
W50Cu50 | 50±1 | Balance | 12.2 | 310-340 | 12.5 |
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