钨铜合金 WCuAlloys
钨铜合金是以钨元素为基、铜元素为副组成的一种两相结构伪合金,是金属中的复合材料。钨铜电子封装片,既具有钨的低膨胀特性,又具有铜的高导热特性,尤为可贵的是,其热膨胀系数和导热导电性可以通过调整材料的成分而加以设计,因而给该材料的应用带来了极大的方便。我们采用高纯的优质原料,经压制成形、高温烧结及熔渗后,得到性能优良的WCu电子封装材料及热沉材料。适用于大功率器件封装;高性能的引|线框架;热控装置的热控板和散热器等。
Wcu alloy is a kind ofpseudo-alloy which possesses both the low expansion of tungsten andthe high thermal conductivity of copper. Its CTE and thermalconductivity can be adjusted by the material composition and thenbe designed so as to bring great convenience for the application.We use high-purity raw materials with good , and thenproduce excellent-performance-wcu heat sinks by pressing, sinteringand infiltrating at high temperature. It is suitable for materialfor the package of high-power devices, the lead frame of highperformance; thermal control device such as thermal control boardand heat sink.
优点:具有与不同基体相匹配的热膨胀系数及高的热导率;优良的高温稳定性及均一性;优良的加工性能;
Advantages: the adjustable CTEthat matches different matrixes and high thermal conductivity;excellent high temperature stability and uniformity, excellentprocessing properties;
| 牌号Material | 钨含量 Tungsten Content | 铜含量 Copper Content | 密度 Density | 热导率 Thermal Conductivity at25℃ | 热膨胀系数 CTE at25℃ |
| Wt% | Wt% | g/cm3 | W/M·K | （10-6/K） | |
| W90Cu10 | 90±1 | Balance | 17.0 | 180-190 | 6.5 |
| W85Cu15 | 85±1 | Balance | 16.4 | 190-200 | 7.0 |
| W80Cu20 | 80±1 | Balance | 15.6 | 200-210 | 8.3 |
| W70Cu30 | 70±1 | Balance | 14.9 | 220-230 | 9.0 |
| W50Cu50 | 50±1 | Balance | 12.2 | 310-340 | 12.5 |
W90Cu10，W85Cu15，W80Cu20，W75Cu25，W70Cu30，W75Cu35，W60Cu40，W65Cu35，W50Cu50，WCu10，钨铜片
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